Description
Special Request:
1. Solder Mask Ink Thickness Line Angle: Min.10um,
Line Surface: 10-30um;
2. Base material position cannot exceed 40um
Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 104.00*109.50
Min W/S(mil): 12/15.2