Description
Special Request:
Solder Mask Ink Thickness Line Angle: Min.10um
Line Surface: 10-30um
Base material position cannot exceed 40um
Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 144.00*135.00
Min W/S(mil): 5.9/8.4