Description
Special Request:
1.Thin board
2.Solder Mask Ink Model: H-9100 8G
3.Solder Mask Thickness: ≥10um
Layer: 2L
Base Material: FR4 TG150,CTI≥175
Board Thickness: 0.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 19.70*66.00
Min W/S(mil): 5.5/7.8
Min Hole Size: 0.2mm