Description
Special Request:
1. Plated Through Hole Copper Wall Thickness: Single Point min. 20um, Average: 25um
2. Solder Mask Thickness: min 10um
3. Outer Layer Final Copper Thickness: min.52.9um
Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Surface Finished: Immersion Silver
Unit Size(mm): 43.18*31.75
Min W/S(mil): 25/25