Description
Special Request:
1. Surface Finished: ENPIG (Ni:120-240U", Pd: min 1.2U", Au: min 2U")
2. Top Layer: Yellow Solder Mask Ink;Bottom Layer: Yellow Coverlay
Layer: 2L
Base Material: PI
Board Thickness: 0.15mm
Final Copper Thickness: min25um
Surface Finished: ENEPIG
Unit Size(mm): 12.10*18.10
Min W/S(mil): 4.9/4.2