Description
Special Request:
1. Outer Layer Final Copper Thickness: min.40um
2. Inner Copper Thickness: 1OZ
3. Solder Mask Thickness: min.10um
Layer: 6L
Base Material: FR4
Board Thickness: 1.6mm
Surface Finished: ENIG
Unit Size(mm): 100.00*162.00
Min W/S(mil): 5.9/5.9
Min Hole Size: 0.25mm