Description
Special Request:
1. Solder Mask: Green Matt(SR-500 GM13)
2. Solder Mask Thickness on Copper Surface: Max 50.8um
3. Plated Through Hole Copper Wall Thickness: Min 38.1um
4. Outer Layer Final Copper Thickness: Min 52.9um
5. Inner Layer Final Copper Thickness: Min 195um
Layer: 8L
Base Material: FR4 TG≥135
Board Thickness: 3.54mm
Surface Finished: ENIG
Unit Size(mm): 454.00*257.00