Description
Special Request:
1. Solder Mask Thickness: min.10um
2. Peelable Mask (high temperature tape on the bottom)
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Tin
Unit Size(mm): 133.25*200.25
Min W/S(mil): 6.3/6.3
Min Hole Size: 0.3mm