Description
Special Request:
1. Plug via with solder mask, conforms to IPC-4761 type VI-b
2. Halogen Free
3. Press fit technology
4. PPAP Level 3 and IMDS supplied
Layer: 4L
Base Material: FR4 TG≥150
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 118.00*118.00
Min W/S(mil): 8/6.14
Min Hole Size: 0.3mm