Description
Special Request:
1. Solder Mask Thickness: min 10um(Copper surface);
2. All layers meet the breakdown voltage 2000V 50Hz;
3. Coil Board, W/S(mil): 3.7/6.3,
The space between the coil position and the finished product: min 5mil
Layer: 4L
Base Material: FR4 TG≥135 CTI≥175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 91.98*102.36
Min Hole Size: 0.3mm