4 Layer Rigid PCB

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4 Layer Rigid PCB
Description

Special Request:

1. Solder Mask Ink Model: H-9100 8G

2. Solder Mask Thickness: ≥10um

3. Outer Final Copper Thickness: Min. 52.9um

4. Inner Final Copper Thickness: Min. 55.7um


Layer: 4L

Base Material: FR4 TG150,CTI≥175

Board Thickness: 1.0mm

Surface Finished: ENIG

Unit Size(mm): 42.00*92.00

Min W/S(mil): 7.9/7.8

Min Hole Size: 0.2mm