Description
Special Request:
1. Solder Mask Ink Thickness: Line Angle: Min.10um,
Line Surface: 10-30um
2. Base material position cannot exceed 40um
Layer: 2L
Base Material: FR4 TG130
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 48.99*57.48
Min W/S(mil): 5.9/5.9
Min Hole Size: 0.3mm