Description
Special Request:
1. Solder Mask Thickness on Copper Edge: Min. 8um,
Solder Mask Thickness on Copper Surface: Min. 10um;
2. V-CUT Remaining Thickness: 0.5+0.2/-0mm.
Layer: 4L
Base Material: FR4 CTI 175V-249V
Board Thickness: 1.63mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 200.00*53.00
Min. W/S(mil): 7.9/7.9
Min. Hole Size: 0.25mm