Description
Special Request:
Solder Mask Ink Model: H-9100 8G,
Solder Mask Thickness: ≥10um
Layer: 4L
Base Material: FR4 TG135,CTII(KB6160)
Board Thickness: 1.55mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 44.00*225.50
Min. W/S(mil): 5.91/8.97
Min. Hole Size: 0.2mm