Description
Special Request:
Solder Mask Ink Model: H-91008G,
Solder Mask Thickness≥10um.
Layer: 4L
Base Material: FR4 TG150,CTI≥175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 30.00*32.00
Min. W/S(mil): 7.87/6.0
Min. Hole Size: 0.25mm