Description
Special Request:
1. Solder Mask Thickness:
Solder Mask Thickness on Copper Edge: Min. 5um,
Solder Mask Thickness on Copper Surface: Min. 8um.
2. Impedance Control
Layer: 6L
Base Material: FR4 TG150 KB6165
Board Thickness: 1.6mm
Final Copper Thickness: 0.5/1OZ(inner/outer)
Surface Finished: ENIG
Unit Size(mm): 92.50*47.00
Min. W/S(mil): 3.94/5.9
Min. Hole Size: 0.2mm