Description
Special Request:
1. Solder Mask Ink Model: PM-500 WD-85SF;
2. Board Bending: ≤ 0.75%;
3. Impedance Control.
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 19.00*150.00
Min. W/S(mil): 5.9/5.9
Min. Hole Size: 0.15mm
Solder Mask: White