Description
Special Request:
1. Solder Mask Ink Model: H-9100 8G,
Solder Mask Thickness: ≥10um;
2. Min. ENIG Gold Plating Thickness: ≥2u",
Nickel thickness: 118u".
Layer: 4L
Base Material: FR4 TG150, CTI≥175, KB6165
Board Thickness: 1.0mm
Outer Layer Final Copper Thickness: 52.9um
Inner Layer Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 42.00*91.70
Min. W/S(mil): 7.9/7.9
Min. Hole Size: 0.2mm