Description
Special Request:
1. Solder Mask Model: H-9100 8G,
Solder Mask Thickness≥10um;
2. ENIG(Gold thickness≥2u",
Ni thickness≥118u");
3. Bow & Twist: ≤0.70%.
Layer: 2L
Base Material: FR4 KB6160
Board Thickness: 1.6mm
Final Copper Thickness: 35UM
Surface Finished: ENIG
Unit Size(mm): 52.90*180.60
Min. Hole Size: 0.3mm