Description
Special Request:
1. Mixed FR4 and Alu together for pressing;
2. Printed the solder mask twice on TOP side;
3. A panel includes 2 different kinds of PCB.
Layer: 2L
Base Material: FR4+Alu(Thermal Conductivity: 2W/m·k)
Board Thickness: 1.80mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 248.00*102.20
Min. Hole Size: 0.3mm
Solder Mask: Matte Black