Special Request:
Solder Mask Ink Thickness: Min. 15um
Layer: 4L
Base Material: FR4 TG140
Board Thickness: 1.575mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 114.30*162.10
Min. W/S(mil): 5/5
Min. Hole Size: 0.25mm
