Description
Special Request:
1. Solder Mask Ink Model: H-9100 8G,
Solder Mask Thickness≥10um.
2. ENIG(Gold Thickness≥2u", Ni Thickness≥118u").
Layer: 4L
Base Material: FR4 TG150, CTI≥175
Board Thickness: 1.0mm
Outer Layer Final Copper Thickness: 52.9UM
Inner Layer Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 42.00*91.70
Min. W/S(mil): 7.9/7.9
Min. Hole Size: 0.2mm