Description
Layer: 4L
Base Material: FR4 TG170
Board Thickness: 0.8mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 22.0*18.0
Panel Size(mm): 138.0*98.0
Min W/S(mil): 4.7/5
Min Hole Size: 0.2mm
Special Request: Half Hole; BGA;
Vias Plugged with Resin; Electroplate Flattened