Description
Special Request:
1. 1-step HDI Blind & Buried Via PCB;
2. Impedance Control;
3. Laser-drilled blind vias need to be filled with resin + copper capped plating of filled via holes;
Laser-drilled blind vias are located on the surface of the SMT pads, PAD surface depression: Max. 20um
Layer: 4L
Base Material: FR4 IT150GTC, PP IT-150GBS
Board Thickness: 0.5+/-0.1mm
Outer Layer Final Copper Thickness: 30um
Inner Layer Final Copper Thickness: 25um
Base Copper Thickness: 1/3OZ
Surface Finished: ENIG
Unit Size(mm): 28.63*30.40
Min. W/S(mil): 3.93/3.93
Min. Hole Size: 0.1mm