Description
Special Request:
1. 3-step HDI PCB.
2. The blind vias are located between layers L1-12, L2-L3, L3-L4, L9-L10, L10-L11, and L11-L12,
as well as L9-L12. They are laser-drilled and require copper filling and capping.
3. Impedance Control.
4. BGA Ball PAD: 0.3mm, BGA Elliptical PAD: 0.25mm.
Layer: 12L
Base Material: FR4 TG170℃
Board Thickness: 1.143mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 0.5OZ&1OZ
Surface Finished: ENIG
Unit Size(mm): 91.60*201.40
Min. W/S(mil): 2.95/2.99
Min. Hole Size: 0.125mm