Description
Special Request:
1. Civil Aviation PCB;
2. 0.2mm Vias: Resin plugged and electroplated filled, compliant with IPC-4761 VII;
3. Blind Vias(L1-L2): Resin plugged and electroplated filled, compliant with IPC-4761 VII.
Layer: 4L
Base Material: FR4 TG150℃
Board Thickness: 0.8±0.12mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 3OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 75.90*12.80
Min. W/S(mil): 7.87/5.9
Min. Hole Size: 0.2mm
Solder Mask: White