Description
Layer: 1L
Base Material: ALU, AL-01-B-20/5052AL(Boyu),
Dielectric Layer Thickness: 100±10%um,
Thermal Conductivity: 2W/m·k(Min.), CTI≥600.
Board Thickness: 1.6mm
Final Copper Thickness: 24.9um
Base Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 220.00*98.00
Min. W/S(mil): 9.8/7.6
Solder Mask: White