Description
Special Request:
1. 3-step HDI PCB.
2. The blind vias are located between layers L1-L2, L2-L3, L3-L4, L9-L10, L10-L11, and L11-L12, as well as L9-L12. They are laser-drilled and require copper filling and capping.
3. 18 groups of Impedance Control.
4. BGA PAD: 0.25mm.
Layer: 12L
Base Material: FR4 TG≥170℃
Board Thickness: 1.5mm
Outer Layer Final Copper Thickness: 30um
Inner Layer Final Copper Thickness: 1/3OZ+plating
Surface Finished: ENIG
Unit Size(mm): 191.00*123.00
Min. W/S(mil): 1.8/2.9
Min. Hole Size: 0.125mm