

Layer: 2L
Base Material: FPC+ALU Stiffener
Board Thickness:
FPC: 0.24+/-0.05mm,
FPC+ALU Stiffener: 1.6mm+/-10%
Final Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 102.00*130.00
Min. W/S(mil): 7.9/7.9
Min. Hole Size: 0.3mm
Solder Mask: Green