

Special Request:
1. Application Field: Medical Device
2. Dielectric Thickness: 80um
Layer: 1L
Base Material: IMS structure with aluminium base and copper-plated pedestal for direct thermal transfer.
Board Thickness: 1.6mm
Final Copper Thickness: 3OZ
Surface Finished: ENIG
Unit Size(mm): 43.00*18.00
Solder Mask: Black