Description
Application Field: Medical Device
Layer: 2L
Base Material: FPC+PI Stiffener+FR4 Stiffener & Adhesive Tape
Board Thickness:
FPC: 0.23+/-0.03mm
FPC+PI Stiffener: 0.3±0.03mm
FPC+FR4 Stiffener+Adhesive Tape: 0.47±0.05mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 36.40*111.00
Min. W/S(mil): 5.9/6.83
Min. Hole Size: 0.3mm
Solder Mask: Green